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Investigation of the Mechanical Behavior of SAC305 Solder J..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Alam, Mohammad S.
;
Rafidh Hassan, K.M.
;
Fahim, Abdullah
... - p. 2175-2184 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00338
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
Investigation of the Mechanical Behavior of SAC305 Solder Joints at Extreme High Temperatures Using Nanoindentation
UL https://suche.suub.uni-bremen.de/peid=ieee-9159401&Exemplar=1&LAN=DE A1 Alam, Mohammad S. A1 Rafidh Hassan, K.M. A1 Fahim, Abdullah A1 Wu, Jing A1 Ahmed, Sudan A1 Suhling, Jeffrey C. A1 Lall, Pradeep YR 2020 SN 2377-5726 K1 Soldering K1 Temperature K1 Aging K1 Creep K1 Temperature measurement K1 Testing K1 Mechanical factors K1 Lead-Free Solder K1 SAC alloy K1 High Temperature K1 Nanoindentation K1 Single Grain K1 Modulus K1 Hardness SP 2175 OP 2184 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00338 DO https://doi.org/10.1109/ECTC32862.2020.00338 SF ELIB - SuUB Bremen
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