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1 Ergebnisse
1
Study of the Impact of Pitch Distance on the Statistical Va..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Jalilvand, Golareh
;
Ahmed, Omar
;
Dube, Nicolas
. - p. 1173-1179 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00188
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
Study of the Impact of Pitch Distance on the Statistical Variation of TSV Protrusion and the Underlying Mechanisms
UL https://suche.suub.uni-bremen.de/peid=ieee-9159404&Exemplar=1&LAN=DE A1 Jalilvand, Golareh A1 Ahmed, Omar A1 Dube, Nicolas A1 Jiang, Tengfei YR 2020 SN 2377-5726 K1 Morphology K1 Shape K1 Through-silicon vias K1 Surface morphology K1 Sociology K1 Statistics K1 Stress K1 Through-Silicon Via K1 Cu protrusion K1 Pitch Distance SP 1173 OP 1179 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00188 DO https://doi.org/10.1109/ECTC32862.2020.00188 SF ELIB - SuUB Bremen
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