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Low Loss BT resin for substrates in 5G communication module:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Yamamoto, Katsuya ; Koga, Shouta ; Seino, Saori... - p. 1795-1800 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00280