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1 Ergebnisse
1
Damage Accumulation in Printed Interconnects on Flex Under ..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Sivasubramony, R.S.
;
Alhendi, M.
;
Kokash, M.Z.
... - p. 1225-1233 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00196
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Damage Accumulation in Printed Interconnects on Flex Under Combinations of Bending and Tension with Different Amplitudes</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159416&Exemplar=1&LAN=DE A1 Sivasubramony, R.S. A1 Alhendi, M. A1 Kokash, M.Z. A1 Yadav, M. A1 Raj, A. A1 Thekkut, S. A1 Enakerakpo, E. A1 Adams, N. A1 Borgesen, P. A1 Poliks, M.D. YR 2020 SN 2377-5726 K1 Strain K1 Resistance K1 Loading K1 Substrates K1 Fatigue K1 Ink K1 Aerosols K1 Reliability K1 Flexible Hybrid Electronics K1 Damage Accumulation K1 Variable Amplitude K1 Variable loadingm Model K1 Nanoparticles SP 1225 OP 1233 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00196 DO https://doi.org/10.1109/ECTC32862.2020.00196 SF ELIB - SuUB Bremen
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