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1 Ergebnisse
1
Damage-Less Singulation of Ultra-Thin Wafers using Stealth ..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Suzuki, Natsuki
;
Nakamura, Tomoji
;
Kondo, Yuta
... - p. 1043-1049 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00169
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
Damage-Less Singulation of Ultra-Thin Wafers using Stealth Dicing
UL https://suche.suub.uni-bremen.de/peid=ieee-9159436&Exemplar=1&LAN=DE A1 Suzuki, Natsuki A1 Nakamura, Tomoji A1 Kondo, Yuta A1 Tominaga, Shimpei A1 Atsumi, Kazuhiro A1 Ohba, Takayuki YR 2020 SN 2377-5726 K1 Wiring K1 Resistance K1 Silicon K1 Power lasers K1 Laser beams K1 Electrical resistance measurement K1 Semiconductor device manufacture K1 3D packaging K1 wafer dicing K1 defects K1 laser SP 1043 OP 1049 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00169 DO https://doi.org/10.1109/ECTC32862.2020.00169 SF ELIB - SuUB Bremen
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