I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Influence of Copper Wire Material Additive Elements to the ..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Klengel, Robert
;
Klengel, Sandy
;
Schischka, Jan
... - p. 774-781 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00127
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Influence of Copper Wire Material Additive Elements to the Reliability of Wire Bonded Contacts</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159444&Exemplar=1&LAN=DE A1 Klengel, Robert A1 Klengel, Sandy A1 Schischka, Jan A1 Stephan, Tino A1 Petzold, Matthias A1 Eto, Motoki A1 Araki, Noritoshi A1 Yamada, Takashi YR 2020 SN 2377-5726 K1 Wires K1 Copper K1 Corrosion K1 High-temperature superconductors K1 Intermetallic K1 Materials reliability K1 APC wire K1 wire bonding K1 corrosion resistance K1 reliable packaging K1 automotive electronics packaging K1 high temperature electronics K1 materials for harsh environments SP 774 OP 781 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00127 DO https://doi.org/10.1109/ECTC32862.2020.00127 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
