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1 Ergebnisse
1
Board Level Reliability Study of WLCSP with 5-Sided and 6-S..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Chi, Yen-Yao
;
Lai, Chieh-Lung
;
Kuo, Chia Yu
... - p. 807-810 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00131
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Board Level Reliability Study of WLCSP with 5-Sided and 6-Sided Protection</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159449&Exemplar=1&LAN=DE A1 Chi, Yen-Yao A1 Lai, Chieh-Lung A1 Kuo, Chia Yu A1 Huang, Jun-Yi A1 Chung, C. Key A1 Jiang, Yih-Jenn A1 Chang, Hong-da A1 Liu, N. W. A1 Lin, Benson YR 2020 SN 2377-5726 K1 Stress K1 Compounds K1 Neck K1 Simulation K1 Surface treatment K1 Lapping K1 Electronic components K1 WLCSP K1 5-sided mWLCSP K1 6-sided mWLCSP K1 Board Level Reliability K1 Temperature Cycling Test K1 Drop Test SP 807 OP 810 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00131 DO https://doi.org/10.1109/ECTC32862.2020.00131 SF ELIB - SuUB Bremen
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