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1 Ergebnisse
1
Panel Packaging Approach to Micro Thin-film Battery Sealing..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Chen, Qianwen
;
Dang, Bing
;
Pancoast, Leanna
... - p. 1560-1565 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00245
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Panel Packaging Approach to Micro Thin-film Battery Sealing for Healthcare and Internet of Things (IoT) Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159451&Exemplar=1&LAN=DE A1 Chen, Qianwen A1 Dang, Bing A1 Pancoast, Leanna A1 Nah, Jae-woong A1 Knickerbocker, John A1 Shih, Andy A1 Cheng, Bo Wen A1 Liu, Kai A1 Niu, Mengnian A1 Nieh, Simon YR 2020 SN 2377-5726 K1 Artificial intelligence K1 Iron K1 Electronic components K1 Conferences K1 Three-dimensional displays K1 5G mobile communication K1 Programmable laser milling K1 Injection molded soldering (IMS) K1 Temporary handling K1 Healthcare K1 IoT K1 Solid State Thin Film Battery K1 Medical Device K1 Implantable Introduction SP 1560 OP 1565 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00245 DO https://doi.org/10.1109/ECTC32862.2020.00245 SF ELIB - SuUB Bremen
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