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A 2-tier Embedded 3D Capacitor with High Aspect Ratio TSV:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chui, King-Jien ; Wang, I-Ting ; Che, Faxing... - p. 611-616 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00101