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1 Ergebnisse
1
Characteristics of Plasma-activated Dielectric Film Surface..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Son, Seongmin
;
Min, Junhong
;
Jung, Eunsuk
... - p. 2025-2032 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00315
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Characteristics of Plasma-activated Dielectric Film Surfaces for Direct Wafer Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159458&Exemplar=1&LAN=DE A1 Son, Seongmin A1 Min, Junhong A1 Jung, Eunsuk A1 Kim, Hoechul A1 Kim, Taeyoung A1 Jeon, Hyungjun A1 Kim, Jinnam A1 Kim, Seokho A1 Moon, Kwangjin A1 Na, Hoonjoo A1 Hwang, Kihyun A1 Yeom, Geun Young YR 2020 SN 2377-5726 K1 Bonding K1 Surface treatment K1 Plasmas K1 Dielectric films K1 Wafer bonding K1 Heat treatment K1 Direct wafer bonding K1 initial bonding energy K1 plasma-modified dielectric surface K1 SiCN-SiCN bonding K1 SiO-SiO bonding SP 2025 OP 2032 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00315 DO https://doi.org/10.1109/ECTC32862.2020.00315 SF ELIB - SuUB Bremen
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