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1 Ergebnisse
1
Irregular Bumps Design Planning for Modern Ball Grid Array ..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Chang, Hsin-Yu
;
Chen, Hung-Ming
;
Kuo, Yun-Chih
... - p. 1838-1843 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00287
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Irregular Bumps Design Planning for Modern Ball Grid Array Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159462&Exemplar=1&LAN=DE A1 Chang, Hsin-Yu A1 Chen, Hung-Ming A1 Kuo, Yun-Chih A1 Tsai, Hsien-Ting A1 Chen, Simon Yi-Hung A1 Jiang, Jyun-Ru A1 Chien, Ya-Ying A1 Chen, Yu-Yang YR 2020 SN 2377-5726 K1 Routing K1 Substrates K1 Manuals K1 Flip-chip devices K1 Wires K1 Pins K1 Planning K1 irregular bump K1 irregular package K1 ball planning K1 substrate routing SP 1838 OP 1843 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00287 DO https://doi.org/10.1109/ECTC32862.2020.00287 SF ELIB - SuUB Bremen
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