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Fan-In Panel-Level with Multiple Diced Wafers Packaging:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, John H ; Ko, Cheng-Ta ; Tseng, Tzvy-Jang... - p. 1146-1153 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00184