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A Novel Warpage Reinforcement Architecture with RDL Interpo..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Peng, Chia-Yu ; Lin, Puru Bruce ; Ko, Cheng-Ta... - p. 526-531 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00089