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Sintered Micro-Silver Paste Doped with Indium for Die Attac..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Tsai, Chin-Hao ; Huang, Wei-Chen ; Kao, C. Robert... - p. 1430-1435 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00226