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Ultra High Density SoIC with Sub-micron Bond Pitch:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chen, Y. H. ; Yang, C. A. ; Kuo, C. C.... - p. 576-581 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00096