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Low Temperature Au-Au Bonding Using Ag Nanoparticles as Int..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Fang, Jun-Peng ; Cai, Jian ; Wang, Qian. - p. 729-734 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00120