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Coaxial Through-Silicon-Vias Using Low-κ SiO2 Insulator:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Yu, Pengbo ; Lin, Hongxiao ; He, Zhiwei... - p. 1167-1172 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00187