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1 Ergebnisse
1
Development of bonding process for flexible devices with fi..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Joo, Jiho
;
Eom, Yong-Sung
;
Jang, Ki-seok
.. - p. 1309-1314 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00207
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159504&Exemplar=1&LAN=DE A1 Joo, Jiho A1 Eom, Yong-Sung A1 Jang, Ki-seok A1 Choi, Gwang-Mun A1 Choi, Kwang-Seong YR 2020 SN 2377-5726 K1 Substrates K1 Silicon K1 Bonding K1 Electrodes K1 Temperature measurement K1 Metals K1 Semiconductor device measurement K1 flexible devices K1 anisotropic solder paste (ASP) K1 laser-assisted bonding (LAB) K1 laser-assisted bonding with compression (LABC) SP 1309 OP 1314 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00207 DO https://doi.org/10.1109/ECTC32862.2020.00207 SF ELIB - SuUB Bremen
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