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Low Warpage Liquid Compression Molding (LCM) Material for H..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chao, Jay ; Zhang, Rong ; Do, Tu... - p. 924-930 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00151