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1 Ergebnisse
1
Thermal and Power Delivery Aware Floorplanning for Heteroge..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Im, Yunhyeok
;
Cho, Young-Sang
;
Hwang, Jisoo
... - p. 2072-2077 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00321
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Thermal and Power Delivery Aware Floorplanning for Heterogeneous Multi Core Design</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159516&Exemplar=1&LAN=DE A1 Im, Yunhyeok A1 Cho, Young-Sang A1 Hwang, Jisoo A1 Lee, Heeseok A1 Yoo, Jongkyu A1 Jeong, James A1 Choi, Heejung A1 Kwon, Yohan A1 Lee, Hoi-Jin A1 Shin, Youngmin YR 2020 SN 2377-5726 K1 Electronic packaging thermal management K1 Thermal analysis K1 Thermal resistance K1 Central Processing Unit K1 Cost function K1 Temperature distribution K1 Floorplan K1 Thermal map K1 PDN K1 cost function K1 multi core K1 thermal solution SP 2072 OP 2077 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00321 DO https://doi.org/10.1109/ECTC32862.2020.00321 SF ELIB - SuUB Bremen
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