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Impact of Electroless-Ni Seed Layer on Cu-Bottom-up Electro..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Mariappan, Murugesan ; Koyanagi, Mitsumasa ; Fukushima, Takafumi - p. 1736-1741 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00271