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1 Ergebnisse
1
Demonstration of Vertically Integrated POP using FOWLP Appr..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Chong, Ser Choong
;
Wai Leong Ching, Eva
;
Pei Siang, Sharon Lim
.. - p. 873-878 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00143
RT T1
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
: T1
Demonstration of Vertically Integrated POP using FOWLP Approach
UL https://suche.suub.uni-bremen.de/peid=ieee-9159520&Exemplar=1&LAN=DE A1 Chong, Ser Choong A1 Wai Leong Ching, Eva A1 Pei Siang, Sharon Lim A1 Lim Siak Boon, Simon A1 Chai, Tai Chong YR 2020 SN 2377-5726 K1 Wires K1 Bonding K1 Microassembly K1 Passivation K1 Stacking K1 Compression molding K1 Fingers K1 Fan-out wafer level package K1 Package on Package K1 wafer level process K1 die attach film K1 low loop wire bonding SP 873 OP 878 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00143 DO https://doi.org/10.1109/ECTC32862.2020.00143 SF ELIB - SuUB Bremen
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