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A Numerical Technique to Evaluate Warpage Behavior of Doubl..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, Chun-Sean ; Tan, Yi Chun ; Kuai Le, Choon. - p. 554-560 , 2020
Link: https://doi.org/10.1109/ECTC32862.2020.00093