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Reliability Investigation of Ultra Fine Line, Multi-Layer C..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Woehrmann, Markus
;
Keller, Aleksander
;
Fritzsch, Thomas
... - p. 893-899 , 2020
Link:
https://doi.org/10.1109/ECTC32862.2020.00146
RT T1 <cTitle>2020 IEEE 70th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Reliability Investigation of Ultra Fine Line, Multi-Layer Copper Routing for Fan-Out Packaging Using a Newly Designed Micro Tensile Test Method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9159535&Exemplar=1&LAN=DE A1 Woehrmann, Markus A1 Keller, Aleksander A1 Fritzsch, Thomas A1 Schiffer, Michael A1 Gollhardt, Astrid A1 Walter, Hans A1 Schneider-Ramelow, Martin A1 Lang, Klaus-Dieter YR 2020 SN 2377-5726 K1 Copper K1 Springs K1 Silicon K1 Force K1 Force measurement K1 Stress K1 Tools K1 tensile test K1 copper properties K1 RDL K1 reliability K1 strain at break K1 strain energy K1 Fan-Out SP 893 OP 899 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32862.2020.00146 DO https://doi.org/10.1109/ECTC32862.2020.00146 SF ELIB - SuUB Bremen
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