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Analysis of 1.2 kV SiC SWITCH-MOS after Short-circuit Stres:
, In:
2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD)
,
Okawa, Masataka
;
Kanamori, Taiga
;
Aiba, Ruito
... - p. 74-77 , 2020
Link:
https://doi.org/10.1109/ISPSD46842.2020.9170050
RT T1
2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD)
: T1
Analysis of 1.2 kV SiC SWITCH-MOS after Short-circuit Stress
UL https://suche.suub.uni-bremen.de/peid=ieee-9170050&Exemplar=1&LAN=DE A1 Okawa, Masataka A1 Kanamori, Taiga A1 Aiba, Ruito A1 Yano, Hiroshi A1 Iwamuro, Noriyuki A1 Harada, Shinsuke YR 2020 SN 1946-0201 K1 Silicon carbide K1 SWITCH-MOS K1 Short-circuit stress K1 Residual damage in SBD region K1 Drain-source leakage current SP 74 OP 77 LK http://dx.doi.org/https://doi.org/10.1109/ISPSD46842.2020.9170050 DO https://doi.org/10.1109/ISPSD46842.2020.9170050 SF ELIB - SuUB Bremen
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