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Pushing the Limits of the Maximum Punch-Through Design with..:

, In: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Buitrago, Elizabeth ; Schneider, Nick ; Corvasce, Chiara... - p. 509-512 , 2020
Link: https://doi.org/10.1109/ISPSD46842.2020.9170103