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Pushing the Limits of the Maximum Punch-Through Design with..:
, In:
2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD)
,
Buitrago, Elizabeth
;
Schneider, Nick
;
Corvasce, Chiara
... - p. 509-512 , 2020
Link:
https://doi.org/10.1109/ISPSD46842.2020.9170103
RT T1
2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD)
: T1
Pushing the Limits of the Maximum Punch-Through Design with an Advanced Buffer for Thin Wafer IGBTs
UL https://suche.suub.uni-bremen.de/peid=ieee-9170103&Exemplar=1&LAN=DE A1 Buitrago, Elizabeth A1 Schneider, Nick A1 Corvasce, Chiara A1 Vobecky, Jan A1 De-Michielis, Luca A1 Rahimo, Munaf YR 2020 SN 1946-0201 SP 509 OP 512 LK http://dx.doi.org/https://doi.org/10.1109/ISPSD46842.2020.9170103 DO https://doi.org/10.1109/ISPSD46842.2020.9170103 SF ELIB - SuUB Bremen
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