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1 Ergebnisse
1
Multi-Bit CNT TSV for 3-D ICs:
, In:
2020 IEEE International Symposium on Circuits and Systems (ISCAS)
,
Vaisband, Boris
;
Maurice, Ange
;
Tan, Chong Wei
.. - p. 1-5 , 2020
Link:
https://doi.org/10.1109/ISCAS45731.2020.9181009
RT T1
2020 IEEE International Symposium on Circuits and Systems (ISCAS)
: T1
Multi-Bit CNT TSV for 3-D ICs
UL https://suche.suub.uni-bremen.de/peid=ieee-9181009&Exemplar=1&LAN=DE A1 Vaisband, Boris A1 Maurice, Ange A1 Tan, Chong Wei A1 Tay, Beng Kang A1 Friedman, Eby G. YR 2020 SN 2158-1525 K1 Through-silicon vias K1 Resistance K1 Capacitance K1 Couplings K1 Leakage currents K1 Substrates K1 3-D IC K1 carbon nanotube K1 through substrate via K1 interconnent SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ISCAS45731.2020.9181009 DO https://doi.org/10.1109/ISCAS45731.2020.9181009 SF ELIB - SuUB Bremen
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