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Multi-Bit CNT TSV for 3-D ICs:

, In: 2020 IEEE International Symposium on Circuits and Systems (ISCAS),
Vaisband, Boris ; Maurice, Ange ; Tan, Chong Wei.. - p. 1-5 , 2020
Link: https://doi.org/10.1109/ISCAS45731.2020.9181009