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Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Inte..:

, In: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Murugesan, M. ; Mori, K. ; Kojima, T.... - p. 1-5 , 2020
Link: https://doi.org/10.1109/ASMC49169.2020.9185397