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1 Ergebnisse
1
Thermal Expansion Phenomena and Influence on Damping Coeffc..:
, In:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Nazdrowicz, Jacek
;
Napieralski, Andrzej
- p. 1246-1254 , 2020
Link:
https://doi.org/10.1109/ITherm45881.2020.9190185
RT T1 <cTitle>2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Thermal Expansion Phenomena and Influence on Damping Coeffcient and Stiffness Variation for MEMS Kinematic Quantity Microsensors and Microactuators</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9190185&Exemplar=1&LAN=DE A1 Nazdrowicz, Jacek A1 Napieralski, Andrzej YR 2020 SN 2577-0799 K1 Springs K1 Damping K1 Temperature sensors K1 Micromechanical devices K1 Actuators K1 Temperature K1 MEMS K1 actuator K1 sensor K1 vibratory gyroscope K1 thermal expansion K1 temperature effect K1 spring constant K1 damping coefficient K1 Q-factor K1 eigenfrequency SP 1246 OP 1254 LK http://dx.doi.org/https://doi.org/10.1109/ITherm45881.2020.9190185 DO https://doi.org/10.1109/ITherm45881.2020.9190185 SF ELIB - SuUB Bremen
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