I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

Comparative Analysis of Package Warpage Using Confocal Meth..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Cai, Chongyang ; Pan, Ke ; Yang, Junbo. - p. 945-949 , 2020
Link: https://doi.org/10.1109/ITherm45881.2020.9190235