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A Memory RAS System Design and Engineering Practice in High..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),

Yao, Aili ; Li, JinFeng ; Wang, Fengqian... - p. 1379-1388 , 2020

Link: https://doi.org/10.1109/ITherm45881.2020.9190253

RT 
T1 <cTitle>2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>A Memory RAS System Design and Engineering Practice in High Temperature Ambient Data Center</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9190253&Exemplar=1&LAN=DE
				
A1 Yao, Aili
A1 Li, JinFeng
A1 Wang, Fengqian
A1 Zhao, Jie
A1 Liu, Hongmei
A1 Zhang, Jiajun
A1 Zhang, Jun
A1 Zhou, Alex
A1 Song, Youquan
A1 Xu, Jialiang
A1 Sun, Paul
A1 Zhu, Kunye
A1 Ahuja, Nishi
A1 Zhu, Dayi
A1 Kuo, Sean
YR 2020
SN 2577-0799
K1 Data centers
K1 Servers
K1 Error correction codes
K1 Reliability
K1 Circuit faults
K1 Data integrity
K1 Cloud computing
K1 Availability
K1 and Serviceability (RAS)
K1 Memory
K1 Advanced Double Device Data Correction
K1 Hwpoison
K1 Recovery and Containment
K1 High Temperature Ambient (HTA)
SP 1379
OP 1388
LK http://dx.doi.org/https://doi.org/10.1109/ITherm45881.2020.9190253
DO https://doi.org/10.1109/ITherm45881.2020.9190253
SF ELIB - SuUB Bremen

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