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1 Ergebnisse
1
The Effect of Misaligned Passive Component on Fatigue Life ..:
, In:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Ha, Jonghwan
;
Pan, Ke
;
Wang, Huayan
.. - p. 1029-1034 , 2020
Link:
https://doi.org/10.1109/ITherm45881.2020.9190328
RT T1 <cTitle>2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>The Effect of Misaligned Passive Component on Fatigue Life of Solder Joints and Solder Shape</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9190328&Exemplar=1&LAN=DE A1 Ha, Jonghwan A1 Pan, Ke A1 Wang, Huayan A1 Won, D. H. A1 Park, S.B. YR 2020 SN 2577-0799 K1 Fatigue K1 Soldering K1 Shape K1 Copper K1 Finite element analysis K1 Solid modeling K1 Minimization K1 Self-alignment K1 Solder Shape K1 Overhanging K1 Misplacement K1 Surface Evolver K1 Fatigue Life SP 1029 OP 1034 LK http://dx.doi.org/https://doi.org/10.1109/ITherm45881.2020.9190328 DO https://doi.org/10.1109/ITherm45881.2020.9190328 SF ELIB - SuUB Bremen
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