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1 Ergebnisse
1
Mechanical Design and Reliability of Gold-Tin Eutectic Bond..:
, In:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Soroush, Farid
;
Jung, Ki Wook
;
Iyengar, Madhusudan
... - p. 957-962 , 2020
Link:
https://doi.org/10.1109/ITherm45881.2020.9190368
RT T1 <cTitle>2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silicon-based Thermal Management Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9190368&Exemplar=1&LAN=DE A1 Soroush, Farid A1 Jung, Ki Wook A1 Iyengar, Madhusudan A1 Malone, Chris A1 Asheghi, Mehdi A1 Goodson, Kenneth YR 2020 SN 2577-0799 K1 Bonding K1 Substrates K1 Silicon K1 Microchannels K1 Temperature measurement K1 Gold K1 Manifolds K1 Gold-tin eutectic bonding K1 tensile test K1 high performance micro-cooler and vapor chamber heat spreaders SP 957 OP 962 LK http://dx.doi.org/https://doi.org/10.1109/ITherm45881.2020.9190368 DO https://doi.org/10.1109/ITherm45881.2020.9190368 SF ELIB - SuUB Bremen
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