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1 Ergebnisse
1
Thermal Performance Evaluation of a Two-Layer Wick Vapor Ch..:
, In:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Joshi, Shailesh N.
;
Zhou, Feng
;
Dede, Ercan M.
... - p. 91-96 , 2020
Link:
https://doi.org/10.1109/ITherm45881.2020.9190372
RT T1
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
: T1
Thermal Performance Evaluation of a Two-Layer Wick Vapor Chamber for High Heat Flux Dissipation by Air Cooling
UL https://suche.suub.uni-bremen.de/peid=ieee-9190372&Exemplar=1&LAN=DE A1 Joshi, Shailesh N. A1 Zhou, Feng A1 Dede, Ercan M. A1 Lohan, Danny J. A1 Sudhakar, Srivathsan A1 Weibel, Justin A. YR 2020 SN 2577-0799 K1 Resistance heating K1 Heat sinks K1 Thermal resistance K1 Substrates K1 Copper K1 Air cooling K1 vapor chamber K1 evaporator wick K1 two-layer wick K1 thermal resistance K1 dryout heat flux SP 91 OP 96 LK http://dx.doi.org/https://doi.org/10.1109/ITherm45881.2020.9190372 DO https://doi.org/10.1109/ITherm45881.2020.9190372 SF ELIB - SuUB Bremen
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