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1 Ergebnisse
1
3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hy..:
, In:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Oprins, Herman
;
Cherman, Vladimir
;
Webers, Tomas
... - p. 219-228 , 2020
Link:
https://doi.org/10.1109/ITherm45881.2020.9190392
RT T1 <cTitle>2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9190392&Exemplar=1&LAN=DE A1 Oprins, Herman A1 Cherman, Vladimir A1 Webers, Tomas A1 Kim, Soon-Wook A1 de Vos, Joeri A1 Van der Plas, Geert A1 Beyne, Eric YR 2020 SN 2577-0799 K1 Bonding K1 Thermal resistance K1 Dielectrics K1 Through-silicon vias K1 Three-dimensional displays K1 Temperature measurement K1 3D Technology K1 Thermal analysis K1 Characterization K1 Hybrid bonding SP 219 OP 228 LK http://dx.doi.org/https://doi.org/10.1109/ITherm45881.2020.9190392 DO https://doi.org/10.1109/ITherm45881.2020.9190392 SF ELIB - SuUB Bremen
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