I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Development of Ultra-Thin Thermal Ground Plane with High Pe..:
, In:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Hu, Ian
;
Huang, Hung-Hsien
;
Huang, Po-Cheng
... - p. 97-103 , 2020
Link:
https://doi.org/10.1109/ITherm45881.2020.9190513
RT T1 <cTitle>2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Development of Ultra-Thin Thermal Ground Plane with High Performance Electroplated Wick</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9190513&Exemplar=1&LAN=DE A1 Hu, Ian A1 Huang, Hung-Hsien A1 Huang, Po-Cheng A1 Yu, Jui-Cheng A1 Liao, Chien-Neng A1 Shih, Meng-Kai A1 Tamg, David A1 Hung, C.P. YR 2020 SN 2577-0799 K1 Current density K1 Fluids K1 Permeability K1 Heat pipes K1 Copper K1 Thermal conductivity K1 Morphology K1 electroplating K1 wick K1 dendrite K1 thermal ground plane K1 micro heat pipe K1 capillary performance K1 effective thermal conductivity K1 heat transfer rate SP 97 OP 103 LK http://dx.doi.org/https://doi.org/10.1109/ITherm45881.2020.9190513 DO https://doi.org/10.1109/ITherm45881.2020.9190513 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
