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1 Ergebnisse
1
Warpage Simulation and Analysis for Panel Level Fan-out Pac..:
, In:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Lan, Jia-Shen
;
Wu, Mei-Ling
- p. 1160-1164 , 2020
Link:
https://doi.org/10.1109/ITherm45881.2020.9190519
RT T1 <cTitle>2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Warpage Simulation and Analysis for Panel Level Fan-out Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9190519&Exemplar=1&LAN=DE A1 Lan, Jia-Shen A1 Wu, Mei-Ling YR 2020 SN 2577-0799 K1 Finite element analysis K1 Compounds K1 Packaging K1 Mathematical model K1 Electromagnetic compatibility K1 Semiconductor device modeling K1 Thermal expansion K1 fan-out package K1 warpage K1 finite element modeling K1 epoxy molding compound K1 and CTE SP 1160 OP 1164 LK http://dx.doi.org/https://doi.org/10.1109/ITherm45881.2020.9190519 DO https://doi.org/10.1109/ITherm45881.2020.9190519 SF ELIB - SuUB Bremen
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