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1 Ergebnisse
1
Effective Substrate Thermal Conductivity Modeling Method Ex..:
, In:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Hwang, Seungtae
;
Lee, Bang weon
;
Kim, Taehwan
... - p. 244-248 , 2020
Link:
https://doi.org/10.1109/ITherm45881.2020.9190556
RT T1 <cTitle>2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Effective Substrate Thermal Conductivity Modeling Method Extracted from Detailed Pattern for Premium SOC Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9190556&Exemplar=1&LAN=DE A1 Hwang, Seungtae A1 Lee, Bang weon A1 Kim, Taehwan A1 Hyun, Younghoon A1 Hwang, Heejung A1 Ryu, Seunggeol A1 Choi, Mina A1 Kim, Youngdeuk A1 Oh, DanKyung Suk YR 2020 SN 2577-0799 K1 Metals K1 Heating systems K1 Thermal conductivity K1 Predictive models K1 Thermal resistance K1 Numerical models K1 Conductivity K1 Effective Thermal Conductivity K1 Piece Simulation K1 Metal Continuity K1 Orthogonal Keff Prediction Model SP 244 OP 248 LK http://dx.doi.org/https://doi.org/10.1109/ITherm45881.2020.9190556 DO https://doi.org/10.1109/ITherm45881.2020.9190556 SF ELIB - SuUB Bremen
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