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1 Ergebnisse
1
Single-phase Cooling Performance of a Topology Optimized an..:
, In:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Joshi, Shailesh N.
;
Yu, Ziqi
;
Sennoun, Hacin
.. - p. 790-795 , 2020
Link:
https://doi.org/10.1109/ITherm45881.2020.9190597
RT T1 <cTitle>2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Single-phase Cooling Performance of a Topology Optimized and Additively-Manufactured Multi-Pass Branching Microchannel Heat Sink</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9190597&Exemplar=1&LAN=DE A1 Joshi, Shailesh N. A1 Yu, Ziqi A1 Sennoun, Hacin A1 Hampshire, Joseph A1 Dede, Ercan M. YR 2020 SN 2577-0799 K1 Heat sinks K1 Heat transfer K1 Microchannels K1 Thermal resistance K1 Resistance heating K1 Single-phase heat transfer K1 multi-pass branching micro heat sink K1 additive manufacturing K1 channel wall roughness K1 pressure drop SP 790 OP 795 LK http://dx.doi.org/https://doi.org/10.1109/ITherm45881.2020.9190597 DO https://doi.org/10.1109/ITherm45881.2020.9190597 SF ELIB - SuUB Bremen
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