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1 Ergebnisse
1
Simulation study f the selective soldering process of the e..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
xiang, Yuyan
;
ning, Xudong
;
yao, Yuan
... - p. 1-5 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9201906
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Simulation study f the selective soldering process of the electrical connector to Printed circle board</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9201906&Exemplar=1&LAN=DE A1 xiang, Yuyan A1 ning, Xudong A1 yao, Yuan A1 zhan, Xiaoyan A1 liu, Guoling A1 li, Ying YR 2020 K1 Soldering K1 Tin K1 Heating systems K1 Temperature measurement K1 Copper K1 Pins K1 selective soldering process K1 finite element analysis K1 electrical connector SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9201906 DO https://doi.org/10.1109/ICEPT50128.2020.9201906 SF ELIB - SuUB Bremen
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