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1 Ergebnisse
1
Tensile performance of line-type microscale Cu/Sn-58Bi/Cu j..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Xing-Min
;
Gui, Jun
;
Li, Wang-Yun
... - p. 1-4 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202518
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Tensile performance of line-type microscale Cu/Sn-58Bi/Cu joints under electro-thermo-mechanical coupled loads</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202518&Exemplar=1&LAN=DE A1 Li, Xing-Min A1 Gui, Jun A1 Li, Wang-Yun A1 Yan, Hai-Dong A1 Qin, Hong-Bo A1 Huang, Jia-Qiang A1 Yang, Dao-Guo YR 2020 K1 Soldering K1 Current density K1 Strain K1 Current K1 Heating systems K1 Lead-free solder joints K1 Tensile performance K1 Fracture behavior K1 Electro-thermo-mechanical coupled loads SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202518 DO https://doi.org/10.1109/ICEPT50128.2020.9202518 SF ELIB - SuUB Bremen
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