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1 Ergebnisse
1
Research on Forming Mechanism and Optimization Scheme of Ac..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
He, Dongyu
;
Li, Pengbo
;
Yu, Hongkun
... - p. 1-6 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202558
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Research on Forming Mechanism and Optimization Scheme of Acid-Etched Pinhole on High-Density Packaging Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202558&Exemplar=1&LAN=DE A1 He, Dongyu A1 Li, Pengbo A1 Yu, Hongkun A1 Lo, Kuang-Lin A1 Ou, Hsien-Hsun A1 Cheng, Xiaoling YR 2020 K1 Copper K1 Corrosion K1 Substrates K1 Ions K1 Plating K1 Etching K1 high density packaging substrate K1 copper plating layer K1 pinhole K1 grain defect K1 ligand compounds K1 surfactant SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202558 DO https://doi.org/10.1109/ICEPT50128.2020.9202558 SF ELIB - SuUB Bremen
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