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Research on the board level reliability of CQFP package wit..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
yu, Fei ; Yang, Zhen-tao ; Peng, Bo.. - p. 1-4 , 2020
Link: https://doi.org/10.1109/ICEPT50128.2020.9202636