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1 Ergebnisse
1
Structure Design and Thermal Simulation Analysis of DBC Sub..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Hu
;
Chang, Chaozheng
;
Liang, Zhi
... - p. 1-4 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202651
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Structure Design and Thermal Simulation Analysis of DBC Substrate for High-Power IGBT Module</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202651&Exemplar=1&LAN=DE A1 Wang, Hu A1 Chang, Chaozheng A1 Liang, Zhi A1 Wang, Jing A1 Yi, Duan A1 Yang, Daoguo YR 2020 K1 Insulated gate bipolar transistors K1 Substrates K1 Heating systems K1 Multichip modules K1 Electronic packaging thermal management K1 Thermal conductivity K1 Periodic structures K1 IGBT module K1 DBC structure K1 ANSYS K1 thermal properties SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202651 DO https://doi.org/10.1109/ICEPT50128.2020.9202651 SF ELIB - SuUB Bremen
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