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1 Ergebnisse
1
Effect of Rapid Thermal Fatigue on Microstructure and Prope..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Tian, Mizhe
;
Gan, Guisheng
;
Cao, Huadong
... - p. 1-4 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202718
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Effect of Rapid Thermal Fatigue on Microstructure and Properties of Sn3.0Ag0.5Cu/Cu Solder Bumps</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202718&Exemplar=1&LAN=DE A1 Tian, Mizhe A1 Gan, Guisheng A1 Cao, Huadong A1 Yang, Donghua A1 Jiang, Liujie A1 Xia, Daquan A1 Sun, Pengfei A1 Liu, Xin A1 Wu, Yiping YR 2020 K1 Electric shock K1 Fatigue K1 Surface cracks K1 Surface morphology K1 Soldering K1 Electronic packaging thermal management K1 Rapid thermal processing K1 Sn3.0Ag0.5Cu K1 Thermal shock K1 Shear strength K1 Interfacial IMCs SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202718 DO https://doi.org/10.1109/ICEPT50128.2020.9202718 SF ELIB - SuUB Bremen
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