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1 Ergebnisse
1
Develop Solderability and welding heat source of the Kovar/..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Wu, Zhicheng
;
Yu, Hui
;
Su, Bin
... - p. 1-3 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202859
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Develop Solderability and welding heat source of the Kovar/Ag interconnector based on finite element simulation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202859&Exemplar=1&LAN=DE A1 Wu, Zhicheng A1 Yu, Hui A1 Su, Bin A1 Liu, Songzhe A1 Lin, Junyi A1 Cui, Xinyu YR 2020 K1 Welding K1 Photovoltaic cells K1 Soldering K1 Silver K1 Solar heating K1 Electrodes K1 Resistance K1 solar cell K1 finite element simulation K1 Kovar/Ag interconnector K1 resistance welding SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202859 DO https://doi.org/10.1109/ICEPT50128.2020.9202859 SF ELIB - SuUB Bremen
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