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Micron Sn-Cu Composite Solder for High-Temperature Applicat..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Yang, Fan ; Wu, Weizhen ; Zhu, Wenbo. - p. 1-4 , 2020
Link: https://doi.org/10.1109/ICEPT50128.2020.9202861