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1 Ergebnisse
1
Analysis and optimization of torsional stress in the solder..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Xie, Jun
;
Huang, Chun-yue
;
Liang, Ying
.. - p. 1-5 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202885
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Analysis and optimization of torsional stress in the solder joint of plate circuit module</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202885&Exemplar=1&LAN=DE A1 Xie, Jun A1 Huang, Chun-yue A1 Liang, Ying A1 Wei, Wei A1 Liu, Shoufu YR 2020 K1 Soldering K1 Stress K1 Electronics packaging K1 Mathematical model K1 Integrated circuit modeling K1 Analytical models K1 Load modeling K1 Plate level circuit solder joint K1 Torsional load K1 Stress strain K1 Response surface method K1 Genetic Algorithm SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202885 DO https://doi.org/10.1109/ICEPT50128.2020.9202885 SF ELIB - SuUB Bremen
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