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1 Ergebnisse
1
Simulation Study on Thermal Characteristics and Thermal Str..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Ye, Weibin
;
Wu, Yanchen
;
Wang, Jing
... - p. 1-5 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202894
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Simulation Study on Thermal Characteristics and Thermal Stress of Semiconductor Laser Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202894&Exemplar=1&LAN=DE A1 Ye, Weibin A1 Wu, Yanchen A1 Wang, Jing A1 Duan, Yi A1 Liu, Jiangwen A1 Yang, Daoguo YR 2020 K1 Semiconductor lasers K1 Electronic packaging thermal management K1 Stress K1 Heat sinks K1 Heating systems K1 Thermal stresses K1 Laser modes K1 Nano-silver K1 semiconductor laser K1 finite element analysis K1 thermal stress SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202894 DO https://doi.org/10.1109/ICEPT50128.2020.9202894 SF ELIB - SuUB Bremen
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