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1 Ergebnisse
1
Effect of thermal ageing on the property of Cu/SAC0307 powd..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Gan, Guisheng
;
Jiang, Liujie
;
Deng, Yongqiang
... - p. 1-4 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202903
RT T1
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
: T1
Effect of thermal ageing on the property of Cu/SAC0307 powder/Cu joint under ultrasonic- assisted at low-temperature
UL https://suche.suub.uni-bremen.de/peid=ieee-9202903&Exemplar=1&LAN=DE A1 Gan, Guisheng A1 Jiang, Liujie A1 Deng, Yongqiang A1 Yang, Xian A1 Jiang, Zhaoqi A1 Chen, Shiqi A1 Xu, Qianzhu A1 Tian, Mizhe A1 Ma, Peng YR 2020 K1 Soldering K1 Aging K1 Zinc K1 Acoustics K1 Lead K1 Morphology K1 Sn0.3Ag0.7Cu K1 Thermal ageing K1 Shear strength K1 Ultrasonic-assisted K1 Interfacial IMCs SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202903 DO https://doi.org/10.1109/ICEPT50128.2020.9202903 SF ELIB - SuUB Bremen
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